Conductive thin film laser etching machine-Fornitore globale

Building 5, Fenglian Pipe Industry, No. 5 Huanglongshan East Road, Donghu Technology Development Zone, Wuhan City

The equipment is suitable for high-speed laser etching and stripping of conductive materials on PET films and Glass substratesSeparation, etching, marking, slicing, material removal, and construction.

Applicable materials

glass/Indium tin oxide on the surface of thin film（ITO）Silver paste（Ag）Carbon nanotubes（CNT）Graphene, nano silver, molybdenum aluminum molybdenum, copper, polymer conductive film, aluminum thin filmPERCPerovskite cellsFTO、TCOUltra fine line wide laser etching of coating materials such as carbon powder.

Application industry

1.Touch screens for mobile phones, cars, tablets, smart wearables, ordering machines, etcGF，GFF，OGS.

2.Car touch screen bodyOGSEtching of the upper conductive film layer.

3.Thin film solar cells, perovskite cells and other photovoltaic industries.

4.Emerging energy industries, such as electrochromic glass.

5.Luminous glass, outdoor display glass, display flexible film, etc.

6. Other display screens.

Product Features

1.Laser etching is a dry etching process with a simple manufacturing process. All processing is automatically controlled by software, resulting in high product consistency and high yield99%No consumables, environmentally friendly, reliable and stable.

2.CCDThe camera automatically locates and has high processing accuracy.

3.The equipment is easy to operate, the drawing file is updated conveniently, the process is shortened, and the utilization rate is high.

4.The device control software can achieve automatic image segmentation, mobile splicing processing, and splicing accuracy up to ±3μm

5.Low power consumption, fewer operators, no pollution, and low production costs.

Technical Parameter/Specification

laser device	fiber laser	Green Laser	ultraviolet LASER
wavelength	1064nm	532nm	355nm
Laser power	20W	10W	10W
pulse width	Nanoseconds, femtoseconds, and picoseconds are optional	Nanoseconds and picoseconds are optional	Nanoseconds and picoseconds are optional
Minimum focused spot	<10 μ m (depending on the material, laser type, and pulse width)
Minimum etching line width	<10 μ m (depending on the material, laser type, and pulse width)
Etching speed	＜4000mm/s
Processing scope	6001200mm/600600mm(Standard size, can be customized according to customer requirements)
Maximum single format	110mmX110mm (Standard configuration, optional according to requirements)
CCDAutomatic positioning accuracy	±3μm
Positioning accuracy of linear motor worktable	±2μm
Repetitive accuracy of linear motor worktable	±1um
Equipment size	1650mmL×1300mmW×1670mmH
Equipment weight	1800kg
Capable of handling file formats	Standard Gerber files, DXF files, PLT files, etc

Yuanlu Optoelectronics has developed a smallFTO、ITOLaser etching equipment can be used for processing in the early experimental stage. Please feel free to inquire by phone.

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